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TI DSP Development Board With a Dual-Layer PCB Dallas TX

This development board, model DES6713, uses dual-layer PCB to avoid a complicated multi-layer design for BGA package DSP systems. It is manufactured based on the high performance, floating-point DSP - the TMS320C6713GDP225 - running at a frequency of 225MHz and operating at a maximum speed of 1800MIPS. The use of an independent power supply for A/D sampling significantly reduces the electro-magnetic interference (EMI) to the computing unit. The source of power supply is selectable.

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TI DSP Development Board With a Dual-Layer PCB

Written by GAO   
Sunday, 27 December 2009 21:09

Toronto, Canada - GAO Embedded (www.GAOEmbedded.com) is offering its TI DSP evaluation development board which can be integrated into a user's systems easily and directly. It is specifically designed for research and experimentation and for product development. The evaluation board provides testing code for CCS, PWM, ADC, SPI, SCI, CAN communication, FFT, DC brush/brushless motor and AC motor SPWM and SVOWM.

This development board, model DES6713, uses dual-layer PCB to avoid a complicated multi-layer design for BGA package DSP systems. It is manufactured based on the high performance, floating-point DSP - the TMS320C6713GDP225 - running at a frequency of 225MHz and operating at a maximum speed of 1800MIPS. The use of an independent power supply for A/D sampling significantly reduces the electro-magnetic interference (EMI) to the computing unit. The source of power supply is selectable. Jumper selected emulator voltage is between 3V and 5V. In addition, the development board provides 256kbytes of memory capacity on chip RAM and an extended 128Kbyte Flash EEPROM to store user-code.

The price of the development board has been reduced to US$389.00. This popular development board is in the line of GAO Embedded's T1 DSP evaluation boards.

Please visit http://www.GAOEmbedded.com for more information or to purchase this product online.

For any sales inquires please ...

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